18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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Along with the "Client-Oriented" small business philosophy, a rigorous high-quality handle system, highly developed producing machines and a powerful R&D group, we always supply high-quality products and solutions, fantastic services and aggressive costs for Copper Foil Capacitor, Pcb Copper Foil Thickness, Copper Foil Distributor, Welcoming interested businesses to cooperate with us, we look forward to owning the opportunity of working with companies around the planet for joint expansion and mutual results.

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

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abide by the contract", conforms on the market requirement, joins from the market competition by its good quality likewise as provides more comprehensive and superb support for customers to let them become large winner. The pursue of the company, is definitely the clients' pleasure for 18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: UAE, Peru, Hungary, Our Company has professional engineers and technical staff to answer your questions about maintenance problems, some common failure. Our product quality assurance, price concessions, any questions about the products, Please feel free to contact us.

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