18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We have state-of-the-art equipment. Our products are exported for the USA, the UK and so on, enjoying a fantastic status among the clients for Hte Copper Foil, Reverse Treated Copper Foil, Ra Ed Copper Foil, We intention at Ongoing system innovation, management innovation, elite innovation and market place innovation, give full play into the overall advantages, and frequently strengthen services excellent.
18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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All we do is usually affiliated with our tenet " Buyer to start with, Belief to start with, devoting about the food packaging and environmental defense for 18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Swansea, Canada, Provence, Our solutions have national accreditation standards for experienced, premium quality items, affordable value, was welcomed by people around the globe. Our goods will continue to increase in the order and look forward to cooperation with you, Really should any of those products be of interest to you, please letus know. We are going to be pleased to give you a quotation up on receipt of one's detailed specifications.
  • In our cooperated wholesalers, this company has the best quality and reasonable price, they are our first choice.
    5 Stars By Dee Lopez from Salt Lake City - 2018.06.28 19:27
    It can be said that this is a best producer we encountered in China in this industry, we feel lucky to work with so excellent manufacturer.
    5 Stars By Daniel Coppin from Lithuania - 2018.11.04 10:32
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