18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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High quality Very first,and Consumer Supreme is our guideline to offer the most beneficial service to our consumers.At present, we're attempting our greatest to be among the top exporters in our area to fulfill buyers far more need to have for Copper Coil Cost, Very Low Profile Copper Foil, Phone Copper Foil, We sincerely welcome friends to negotiate business and start cooperation with us. We hope to join hands with friends in different industries to create a brilliant future.
18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our mission will be to become an innovative supplier of high-tech digital and communication devices by furnishing benefit added structure, world-class manufacturing, and service capabilities for 18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Macedonia, Jakarta, Kuwait, With a wide range, good quality, reasonable prices and stylish designs, our products are extensively used in this field and other industries. We welcome new and old customers from all walks of life to contact us for future business relationships and achieving mutual success! We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.
  • This company can be well to meet our needs on product quantity and delivery time, so we always choose them when we have procurement requirements.
    5 Stars By April from Kyrgyzstan - 2017.11.29 11:09
    A good manufacturers, we have cooperated twice, good quality and good service attitude.
    5 Stars By Arabela from America - 2017.12.31 14:53
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