2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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With state-of-the-art technologies and facilities, strict good quality regulate, reasonable cost, exceptional assistance and close co-operation with prospects, we're devoted to supplying the top benefit for our customers for Shielding Copper Foil, Copper Foil Hte Pcb, Graphite Coated Copper Foil, We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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The key to our success is "Good Product Excellent, Reasonable Rate and Efficient Service" for 2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Grenada, Auckland, Portland, Our company now has many department, and there have more than 20 employees in our company. We set up sales shop, show room, and product warehouse. In the meantime, we registered our own brand. We've got tightened inspection for quality of product.
  • A nice supplier in this industry, after a detail and careful discussion, we reached a consensus agreement. Hope that we cooperate smoothly.
    5 Stars By Mona from Czech - 2018.12.25 12:43
    The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Honorio from British - 2017.06.22 12:49
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