2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM
2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
|
Classification |
Unit |
Requirement |
Test Method |
||||||||
|
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
||
|
Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
|
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
|||||||
|
Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
||||||
|
H.T.(180°C) |
≥138 |
||||||||||
|
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
|
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
|
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
| Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
||||||||
| Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
| H.T.(200°C) | Minutes |
30 |
|||||||||
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:
Related Product Guide:
Our aim would be to fulfill our shoppers by offering golden company, very good value and good quality for 2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Philippines, Stuttgart, Serbia, With the superior and exceptional service, we've been well developed along with our customers. Expertise and know-how ensure that we are always enjoying the trust from our customers in our business activities. "Quality", "honesty" and "service" is our principle. Our loyalty and commitments remain respectfully at your service. Contact Us Today For further information, contact us now.
By olivier musset from Sheffield - 2018.06.12 16:22
The factory workers have a good team spirit, so we received high quality products fast, in addition, the price is also appropriate, this is a very good and reliable Chinese manufacturers.
By Clara from Bulgaria - 2017.09.30 16:36
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