2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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abide by the contract", conforms on the market requirement, joins from the market competition by its good quality likewise as provides more comprehensive and superb support for customers to let them become large winner. The pursue of the company, is definitely the clients' pleasure for 2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Malaysia, luzern, Romania, Till now, the goods list has been updated regularly and attracted clients from around the globe. Detailed facts is often obtained in our web-site and you'll be served with premium quality consultant service by our after-sale group. They are going to help you get comprehensive acknowledge about our products and make a satisfied negotiation. Company go to to our factory in Brazil is also welcome at any time. Hope to obtain your inquiries for any pleased co-operation.
  • Products and services are very good, our leader is very satisfied with this procurement, it is better than we expected,
    5 Stars By Phyllis from Bahrain - 2018.05.13 17:00
    The company comply with the contract strict, a very reputable manufacturers, worthy a long-term cooperation.
    5 Stars By Olivia from Florence - 2017.09.26 12:12
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