2021 New Style Copper Foil Hs Code - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

We continuously execute our spirit of ''Innovation bringing development, Highly-quality ensuring subsistence, Management advertising and marketing gain, Credit history attracting buyers for Teflon Laminate Copper Foil Pcb, 1 Oz Copper Foil, Rolls Of Copper Foil, our merchandise have superior popularity from the whole world as its most competive cost and our most advantage of after-sale assistance for the clients。
2021 New Style Copper Foil Hs Code - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 New Style Copper Foil Hs Code - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

2021 New Style Copper Foil Hs Code - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

No matter new customer or old customer, We believe in long term and trusted relationship for 2021 New Style Copper Foil Hs Code - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Somalia, Sri Lanka, Jeddah, Our company, is always regarding quality as company' s foundation, seeking for development via high degree of credibility , abiding by iso9000 quality management standard strictly , creating top-ranking company by spirit of progress-marking honesty and optimism.
  • It is not easy to find such a professional and responsible provider in today's time. Hope that we can maintain long-term cooperation.
    5 Stars By Cora from Argentina - 2018.12.14 15:26
    The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Lena from Yemen - 2018.12.22 12:52
    Write your message here and send it to us