Best quality Copper Foil Emi Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Having a positive and progressive attitude to customer's fascination, our organization constantly improves our solution high-quality to fulfill the requirements of shoppers and further focuses on safety, reliability, environmental prerequisites, and innovation of Copper Foil Roll, Battery Copper Foil, Black Backed Copper Foil, We intention at Ongoing system innovation, management innovation, elite innovation and market place innovation, give full play into the overall advantages, and frequently strengthen services excellent.
Best quality Copper Foil Emi Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Best quality Copper Foil Emi Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Best quality Copper Foil Emi Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our pursuit and enterprise goal is to "Always satisfy our customer requirements". We keep on to establish and style and design outstanding top quality goods for both our outdated and new prospects and realize a win-win prospect for our clientele likewise as us for Best quality Copper Foil Emi Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Namibia, Tanzania, The Swiss, Whether selecting a current product from our catalog or seeking engineering assistance for your application, you can talk to our customer service center about your sourcing requirements. We can provided good quality with competitive price for you.
  • Staff is skilled, well-equipped, process is specification, products meet the requirements and delivery is guaranteed, a best partner!
    5 Stars By Henry from Zambia - 2017.05.02 18:28
    The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Eunice from Rwanda - 2017.10.25 15:53
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