Best quality Copper Foil Thickness - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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While using the "Client-Oriented" organization philosophy, a rigorous top quality command process, highly developed production devices and a potent R&D workforce, we normally provide high quality products, outstanding solutions and aggressive charges for 9 Micron Copper Foil, Rf Shielding Copper Foil, Copper Foil 0.0005, We believe that you will be glad with our realistic selling price, high-quality products and solutions and rapid delivery. We sincerely hope you can give us an prospect to provide you and be your best partner!
Best quality Copper Foil Thickness - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Best quality Copper Foil Thickness - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Best quality Copper Foil Thickness - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We retain bettering and perfecting our goods and service. At the same time, we perform actively to do research and enhancement for Best quality Copper Foil Thickness - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Buenos Aires, New Zealand, Switzerland, As a well educated, innovative and energetic staff,we are responsible for all elements of the research, design, manufacturing, sales and distribution. With studying and developing new techniques,we are not only following but also leading the fashion industry. We listen attentively to the feedback from our customers and provide instant communication. You will instantly feel our expertise and attentive service.
  • After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
    5 Stars By Victoria from Serbia - 2018.11.28 16:25
    The factory workers have rich industry knowledge and operational experience, we learned a lot in working with them,we are extremely grateful that we can encount a good company has excellent wokers.
    5 Stars By Myrna from Georgia - 2018.06.30 17:29
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