Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We now have our individual sales group, layout team, technical team, QC crew and package group. Now we have strict high-quality control procedures for each procedure. Also, all of our workers are experienced in printing discipline for 1 Oz Copper Foil Thickness-, Copper Foil Etching, Copper Foil For Lithium Battery, We welcome new and previous customers from all walks of lifestyle to call us for upcoming business enterprise interactions and reach mutual accomplishment!
Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Detroit, Leicester, Swiss, Our Company has qualified engineers and technical staff to answer your questions about maintenance problems, some common failure. Our product quality assurance, price concessions, any questions about the items, Be sure to feel free to contact us.
  • Superb technology, perfect after-sales service and efficient work efficiency, we think this is our best choice.
    5 Stars By Julia from Uganda - 2018.12.11 11:26
    The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Ryan from Madagascar - 2017.03.28 12:22
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