Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Along with the "Client-Oriented" enterprise philosophy, a rigorous high-quality control process, superior production products along with a robust R&D group, we constantly deliver premium quality products, exceptional solutions and aggressive costs for Copper Foil Manufacturers, Reverse Treated Copper Foil, Copper Foil 0.05mm, Customers first! Whatever you require, we should do our utmost to help you. We warmly welcome customers from all over the world to cooperate with us for mutual development.
Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for Best-Selling Laminated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Poland, French, Uzbekistan, With the spirit of "credit first, development through innovation, sincere cooperation and joint growth", our company is striving to create a brilliant future with you, so as to become a most valuable platform for exporting our goods in China!
  • After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
    5 Stars By Alice from Algeria - 2017.06.25 12:48
    The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
    5 Stars By Liz from Mexico - 2017.05.02 11:33
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