Competitive Price for 9 Micron Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM


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Being supported by an innovative and experienced IT team, we could present technical support on pre-sales & after-sales service for Copper Foil Ipc-4562, 1 Oz Copper Foil, Electrodeposited Copper Foil, If you are interested in any of our products or would like to discuss a custom order, please feel free to contact us.
Competitive Price for 9 Micron Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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Competitive Price for 9 Micron Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM detail pictures


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We believe in: Innovation is our soul and spirit. Top quality is our life. Purchaser need is our God for Competitive Price for 9 Micron Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Jakarta, Auckland, Somalia, The design, processing, purchasing, inspection, storage, assembling process are all in scientific and effective documentary process , increasing usage level and reliability of our brand deeply, which makes us become superior supplier of the four major product categories shell castings domestically and obtained the customer's trust well.
  • We are a small company that has just started, but we get the company leader's attention and gave us a lot of help. Hope we can make progress together!
    5 Stars By Darlene from Accra - 2018.08.12 12:27
    This supplier stick to the principle of "Quality first, Honesty as base", it is absolutely to be trust.
    5 Stars By Vanessa from Turin - 2017.08.15 12:36
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