factory low price Copper Foil For Pcb Manufacturing - Hyper Very Low Profile Copper Foil For High speed digital – JM
factory low price Copper Foil For Pcb Manufacturing - Hyper Very Low Profile Copper Foil For High speed digital – JM Detail:
Features
● Ultra low profile with high peel strength and good etch ability
● Use Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit
● The treated foil is pink
Typical application
● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE
Typical Properties of Hyper Very Low profile Copper Foil
|
Classification |
Unit |
Test Method |
Test Method |
|||
|
Nominal thickness |
Um |
12 |
18 |
35 |
IPC-4562A |
|
|
Area Weight |
g/m² |
107±5 |
153±7 |
285±10 |
IPC-TM-650 2.2.12.2 |
|
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
|||
|
Roughness |
Shiny side (Ra) |
սm |
≤0.43 |
≤0.43 |
≤0.43 |
IPC-TM-650 2.3.17 |
|
Matte side(Rz) |
um |
1.5-2.0 |
1.5-2.0 |
1.5-2.0 |
|
|
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥300 |
≥300 |
≥300 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C) |
≥180 |
≥180 |
≥180 |
|
||
|
Elongation |
R.T.(23°C) |
% |
≥5 |
≥6 |
≥8 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C) |
≥6 |
≥6 |
≥6 |
|
||
|
Pinholes & Porosity |
Number |
No |
IPC-TM-650 2.1.2 |
|||
|
Peel Strength |
N/mm |
≥0.6 |
≥0.8 |
≥1.0 |
IPC-TM-650 2.4.8 |
|
|
Lbs/in |
≥3.4 |
≥4.6 |
≥5.7 |
|||
|
Anti-oxidization |
R.T.(23°C) |
Days |
90 |
|
||
|
R.T.(200°C) |
Minutes |
40 |
||||
Product detail pictures:
Related Product Guide:
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By Sahid Ruvalcaba from Haiti - 2017.11.12 12:31
The factory can meet continuously developing economic and market needs, so that their products are widely recognized and trusted, and that's why we chose this company.
By Sahid Ruvalcaba from Australia - 2017.05.02 18:28
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