Factory making Ra Ed Copper Foil - Matte Side Treatment Very Low Profile Copper in Black/red (VLP-S-B/R) – JM


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Factory making Ra Ed Copper Foil - Matte Side Treatment Very Low Profile Copper in Black/red (VLP-S-B/R) – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated with JIMA’s proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Detail

● ID: 76 mm, 152 mm
● Roll Length/Outer diameter/Inner diameter: as request
● Core length: as request
● Core material: Paper and ABS plastic & Customize
● Sample can be supply
● Inner Package: can supply Vacuum packaging if need

Features

● Low profile for FCCL
● Grain structure of copper foil leads to high flexibility
● Excellent etching performance
● The treated foil is red or black
● Low profile enables to make fine circuit pattern

Typical application

● Casting and lamination type FCCL
● Fine pattern FPC&PWB
● Chip on flex for LED
● For FPC or Inner layer
● For a wide range of applications, from circuit boards to optics.

Typical properties of Matte Side Treatment Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

10

12

16

25

35

IPC-4562A

Area Weight

g/m²

98±4

107±4

153± 5

228± 8

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤2.5

≤2.5

≤2.5

≤2.5

≤2.5

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.0

≤4.5

≤5.5

≤6.0

≤8.0

Tensile Strength

R.T.(23°C)

Mpa

≥260

≥260

≥280

≥280

≥280

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

≥10

≥12

IPC-TM-650 2.4.18

 

H.T.(180°C)

≥5

≥6

≥7

≥8

≥8

Peel Strength(FR-4)

N/mm

≥0.7

0.8

1.0

1.1

1.2

IPC-TM-650 2.4.8

 

lbs/in

≥4

≥4.6

≥5.7

≥6.3

≥6.9

Pinholes & porosity

Number

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

 

180

 

R.T.(200°C)

 

60

 

Standard Width: 520mm 1040mm 1100mm, Max.1300mm May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory making Ra Ed Copper Foil - Matte Side Treatment Very Low Profile Copper in Black/red (VLP-S-B/R) – JM detail pictures


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