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Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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  • Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM
  • Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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We now have our individual sales group, layout team, technical team, QC crew and package group. Now we have strict high-quality control procedures for each procedure. Also, all of our workers are experienced in printing discipline for Polished Copper Foil, 1290mm Wide 105um / 3oz Thickness, Pcb Copper Foil Thickness, If you have any comments about our company or products, please feel free to contact us, your coming mail will be highly appreciated.
Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

Related Product Guide:
With our leading technology also as our spirit of innovation,mutual cooperation, benefits and development, we are going to build a prosperous future jointly with your esteemed company for Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Bogota, Ecuador, Rotterdam, Our items are widely recognized and trusted by users and can meet continuously changing economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
    • Managers are visionary, they have the idea of "mutual benefits, continuous improvement and innovation", we have a pleasant conversation and Cooperation.
    5 Stars By Alice from Gabon - 2017.08.18 18:38
    It's really lucky to find such a professional and responsible manufacturer, the product quality is good and delivery is timely, very nice.
    5 Stars By Joyce from Toronto - 2017.09.29 11:19
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