Factory Price 1290mm Wide 105um / 3oz Thickness - Very Low Profile Copper Foil (VLP-S-P/B) – JM


Product Detail

Product Tags

Related Video

Feedback (2)

"Based on domestic market and expand abroad business" is our enhancement strategy for Copper Foil Etching, Copper Foil Hs Code, Copper Strip Coil, We adhere to the tenet of "Services of Standardization, to Meet Customers' Demands".
Factory Price 1290mm Wide 105um / 3oz Thickness - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory Price 1290mm Wide 105um / 3oz Thickness - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


Related Product Guide:

Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" plus the theory of "quality the basic, have faith in the main and management the advanced" for Factory Price 1290mm Wide 105um / 3oz Thickness - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: French, Ottawa, Lithuania, Our company will continue to adhere to the " superior quality, reputable, the user first " principle wholeheartedly. We warmly welcome friends from all walks of life to visit and give guidance, work together and create a brilliant future!
  • The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Ethan McPherson from Afghanistan - 2018.09.29 13:24
    Products and services are very good, our leader is very satisfied with this procurement, it is better than we expected,
    5 Stars By Judith from Thailand - 2018.11.02 11:11
    Write your message here and send it to us