Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We have probably the most state-of-the-art output equipment, experienced and qualified engineers and workers, recognized good quality manage systems plus a friendly skilled income workforce pre/after-sales support for Copper Foil 0.1mm, Copper Foil For Printed Circuit Board, 1 Ounce Copper Foil, Our main objectives are to deliver our consumers worldwide with high quality, competitive selling price, satisfied delivery and outstanding providers.
Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

The company keeps to the operation concept "scientific management, high quality and efficiency primacy, customer supreme for Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Honduras, Bangalore, Southampton, We supply skilled service, prompt reply, timely delivery, excellent quality and best price to our customers. Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound items with good logistics service and economical cost. Depending on this, our products and solutions are sold very well in the countries in Africa, the Mid-East and Southeast Asia. Adhering to the business philosophy of ??customer first, forge ahead', we sincerely welcome clients from at home and abroad to cooperate with us.
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