Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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With dependable high-quality method, fantastic standing and ideal purchaser assistance, the series of products produced by our firm are exported to many countries and regions for Copper Foil Antenna, Foil Copper, 8 Mil Copper Foil, With a fast development and our customers come from Europe, United States, Africa and all over the world. Welcome to visit our factory and welcome your order, for further inquires please do not hesitate to contact us!
Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Assume full duty to satisfy all demands of our clients; reach steady advancements by marketing the development of our purchasers; grow to be the final permanent cooperative partner of clientele and maximize the interests of customers for Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Costa rica, New Delhi, Cyprus, We adhere to client 1st, top quality 1st, continuous improvement, mutual advantage and win-win principles. When cooperation together with the customer, we provide shoppers with the highest high-quality of service. Established good business relations using the Zimbabwe buyer inside the business, we've got established own brand and reputation. At the identical time, wholeheartedly welcome new and old prospects to our company to go to and negotiate small business.
  • Timely delivery, strict implementation of the contract provisions of the goods, encountered special circumstances, but also actively cooperate, a trustworthy company!
    5 Stars By Gustave from Bolivia - 2017.08.18 11:04
    The company has rich resources, advanced machinery, experienced workers and excellent services, hope you keep improving and perfecting your products and service, wish you better!
    5 Stars By Adela from Borussia Dortmund - 2018.10.01 14:14
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