Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Our objective is to present premium quality products at aggressive prices, and top-notch services to buyers around the world. We have been ISO9001, CE, and GS certified and strictly adhere to their excellent specifications for Pure Copper Foil, Copper Foil For Battery, C11000 Copper Foil, We hope we are able to have a pleasant partnership with businessman from all over the environment.
Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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The customer satisfaction is our primary target. We uphold a consistent level of professionalism, quality, credibility and service for Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Thailand, Berlin, Estonia, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We are looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!
  • We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.
    5 Stars By Eileen from Adelaide - 2017.06.19 13:51
    We have been appreciated the Chinese manufacturing, this time also did not let us disappoint,good job!
    5 Stars By Mamie from Netherlands - 2018.06.26 19:27
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