High definition Shielding Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM
High definition Shielding Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:
The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.
Features
● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.
Typical application
● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE
Typical Properties of Ultra Low Profile Copper Foil
|
Classification |
Unit |
Test Method |
Test Method |
|||
|
Nominal thickness |
Um |
12 |
18 |
35 |
IPC-4562A |
|
|
Area Weight |
g/m² |
107±5 |
153±7 |
285±10 |
IPC-TM-650 2.2.12.2 |
|
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
|||
|
Roughness |
Shiny side (Ra) |
սm |
≤0.43 |
≤0.43 |
≤0.43 |
IPC-TM-650 2.3.17 |
|
Matte side(Rz) |
um |
1.5-2.0 |
1.5-2.0 |
1.5-2.0 |
|
|
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥300 |
≥300 |
≥300 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C) |
≥180 |
≥180 |
≥180 |
|
||
|
Elongation |
R.T.(23°C) |
% |
≥5 |
≥6 |
≥8 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C) |
≥6 |
≥6 |
≥6 |
|
||
|
Pinholes & Porosity |
Number |
No |
IPC-TM-650 2.1.2 |
|||
|
Peel Strength |
N/mm |
≥0.6 |
≥0.8 |
≥1.0 |
IPC-TM-650 2.4.8 |
|
|
Lbs/in |
≥3.4 |
≥4.6 |
≥5.7 |
|||
|
Anti-oxidization |
R.T.(23°C) |
Days |
90 |
|
||
|
R.T.(200°C) |
Minutes |
40 |
||||
Product detail pictures:
Related Product Guide:
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By Mike from Zurich - 2017.09.09 10:18
