High Performance Insulated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We insist about the theory of growth of 'High excellent, Performance, Sincerity and Down-to-earth working approach' to offer you with great company of processing for 2 Oz Copper Foil Thickness, 5 Micron Copper Foil, Ra Copper Foil With Nickel Plating, We welcome new and old customers from all walks of life to contact us for future business relationships and achieving mutual success!
High Performance Insulated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

High Performance Insulated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

High Performance Insulated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We are going to dedicate ourselves to providing our esteemed buyers together with the most enthusiastically thoughtful products and services for High Performance Insulated Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Kazakhstan, Philadelphia, Armenia, Upon today, we have customers from all over the world, including USA, Russia, Spain, Italy, Singapore, Malaysia, Thailand, Poland, Iran and Iraq. The mission of our company is to provide the highest quality products with best price. We are looking forward to doing business with you!
  • High Quality, High Efficiency, Creative and Integrity, worth having long-term cooperation! Looking forward to the future cooperation!
    5 Stars By Albert from luzern - 2018.10.31 10:02
    The company keeps to the operation concept "scientific management, high quality and efficiency primacy, customer supreme", we have always maintained business cooperation. Work with you,we feel easy!
    5 Stars By Meroy from Ireland - 2017.09.22 11:32
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