High Performance Insulated Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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Our firm has been concentrating on brand strategy. Customers' satisfaction is our best advertising. We also offer OEM provider for Copper Coil, Very Low Profile Copper Foil, Copper Foil 0.0005, Please feel free to contact us at any time. We will reply you when we receive your inquiries. Please note that samples are available before we start our business.

High Performance Insulated Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification		Unit	Requirement								Test Method
Nominal thickness		Um	12	18		25	35	50	70	105	IPC-4562A
Area Weight		g/m²	107±5	153±7		225±8	285± 10	435±15	585± 20	870±30	IPC-TM-650 2.2.12.2
Purity		%	≥99.8								IPC-TM-650 2.3.15
roughness	Shiny side (Ra)	սm	≤0.43								IPC-TM-650 2.3.17
roughness	Matte side(Rz)	um	≤4.5	≤5.0		≤6.0	≤7.0	≤8.0	≤12	≤14	IPC-TM-650 2.3.17
Tensile Strength	R.T.(23°C)	Mpa	≥207				≥276				IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥138								IPC-TM-650 2.4.18
Elongation	R.T.(23°C)	%	≥4	≥4		≥5	≥8	≥10	≥12	≥12	IPC-TM-650 2.4.18
Elongation	H.T.(180°C	%	≥4	≥4		≥5	≥6	≥8	≥8	≥8	IPC-TM-650 2.4.18
Resistivity		Ω.g/m²	≤0.17 0	≤0.1 66			≤0.16 2		≤0.16 2	≤0.16 2	IPC-TM-650 2.5.14
Peel Strength(FR-4)		N/mm	≥1.0	≥1.3			≥1.6		≥1.6	≥2.1	IPC-TM-650 2.4.8
Pinholes & Porosity		Number			No						IPC-TM-650 2.1.2
Anti-oxidization	R.T.(23°C)	Days			180
Anti-oxidization	H.T.(200°C)	Minutes			30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

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Using a total scientific good quality management process, superior high quality and excellent faith, we get great name and occupied this field for High Performance Insulated Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Macedonia, Maldives, Mexico, we are sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

2 Mil Copper Foil