High Quality for Copper Foil 0.05mm - Low Coarsening Reverse Treated Copper Foil – JM


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High Quality for Copper Foil 0.05mm - Low Coarsening Reverse Treated Copper Foil – JM Detail:

Detail

● Thickness: 12um 18um 35um 70um
● Standard Width: 1290mm, we can do cutting as size requirement
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-30days
● Term: FOB, CIF…
● Payment item: 50%T/T deposit, balance pay before shipping.

Features

● Reverse treated copper foil
● Low profile, with high peel strength
● The treated foil is pink
● As reverse-treated copper foil, this product has better etchability performance. It can effectively shorten the production process, achieve higher speed and fast micro-etching, and improve the conformance rate of PCBs.

Application

● High frequency, Ultra -high frequency, applying to PPE board
● Fine circuit pattern
● It is mainly applied in multilayered boards and high-frequency boards.

Typical Properties of Low Coarsening Reverse Treated Copper Foil

Classification

Unit

Requirement

Test Method

Nominal thickness

um

12

18

35

70

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

585± 20

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

3.0

IPC-TM-650 2.2.17

Matte side(Rz)

um

≤5.0

≤6.0

≤8.0

≤10

Tensile Strength

R.T.(23°C)

Mpa

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥8

≥12

IPC-TM-650 2.4.18

H.T.(180°C)

≥3

≥4

≥4

≥4

Peel Strength(FR-4)

N/mm

≥1.0

≥1.2

≥1.4

≥1.8

IPC-TM-650 2.4.8

Lbs/in

≥5.7

≥7.4

≥8.0

≥10.2

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

30

 

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Electrolytic copper foil Image

5G High frequency Board Ultra Low Profile Copper Foil1


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High Quality for Copper Foil 0.05mm - Low Coarsening Reverse Treated Copper Foil – JM detail pictures


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    5 Stars By Martin Tesch from Sao Paulo - 2018.06.12 16:22
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