High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Along with the "Client-Oriented" enterprise philosophy, a rigorous high-quality control process, superior production products along with a robust R&D group, we constantly deliver premium quality products, exceptional solutions and aggressive costs for C11000 Copper Foil, Black Backed Copper Foil, Copper Foil Manufacturers, Welcome any inquiry to our company. We will be glad to establish friendly business relationships with you!
High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate inside our success for High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Los Angeles, US, Mexico, With the first-class solutions, excellent service, fast delivery and the best price, we've won highly praise foreign customers'. Our products have been exported to Africa, the Middle East, Southeast Asia and other regions.
  • Adhering to the business principle of mutual benefits, we have a happy and successful transaction, we think we will be the best business partner.
    5 Stars By Heloise from European - 2018.06.19 10:42
    The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Lillian from Angola - 2017.06.22 12:49
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