Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We have our own product sales staff, style crew, technical group, QC staff and package staff. We now have strict high quality management procedures for each approach. Also, all of our workers are experienced in printing subject for Wd Copper Shielding Foil, Electrolytic Copper Foil Manufacturers, High Purity Copper Foil For Lithium Battery, At our firm with quality first as our motto, we manufacture products that are entirely made in Japan, from materials procurement to processing. This enables them to be used with confident peace of mind.
Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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  • The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Eudora from Greece - 2018.12.10 19:03
    It's really lucky to find such a professional and responsible manufacturer, the product quality is good and delivery is timely, very nice.
    5 Stars By Lena from Madrid - 2017.09.16 13:44
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