Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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owing to excellent assistance, a variety of high quality products and solutions, aggressive costs and efficient delivery, we take pleasure in an excellent popularity amongst our customers. We are an energetic business with wide market for 3/8 Oz Copper Foil, Copper Foil 10 Mil, 6um Copper Foil, We believe that in good quality more than quantity. Before export of the hair there is strict top quality control check during treatment as per international good quality standards.
Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We are going to make every single effort for being excellent and excellent, and accelerate our ways for standing while in the rank of international top-grade and high-tech enterprises for Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: London, Niger, Bangladesh, "Good quality and reasonable price" are our business principles. If you are interested in our products or have any questions, please feel free to contact us. We hope to establish cooperative relationships with you in the near future.
  • This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By June from Qatar - 2018.07.12 12:19
    The company leader recept us warmly, through a meticulous and thorough discussion, we signed a purchase order. Hope to cooperate smoothly
    5 Stars By Andrea from Guatemala - 2018.07.27 12:26
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