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Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM

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  • Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM

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Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM detail pictures

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Our mission should be to turn out to be an innovative supplier of high-tech digital and communication devices by furnishing benefit added design and style, world-class manufacturing, and repair capabilities for Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Durban, Bolivia, Oman, With the spirit of "high quality is our company's life; good reputation is our root", we sincerely hope to cooperate with customers from at home and abroad and hope to build a good relationship with you.
    • As an international trading company, we have numerous partners, but about your company, I just want to say, you are really good, wide range, good quality, reasonable prices, warm and thoughtful service, advanced technology and equipment and workers have professional training, feedback and product update is timely, in short, this is a very pleasant cooperation, and we look forward to the next cooperation!
    5 Stars By Johnny from Philippines - 2017.09.30 16:36
    This is a very professional wholesaler, we always come to their company for procurement, good quality and cheap.
    5 Stars By Nelly from Saudi Arabia - 2017.09.30 16:36
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