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Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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  • Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM
  • Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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We're committed to providing easy,time-saving and money-saving one-stop purchasing service of consumer for Copper Strip Coil, Copper Foil Shielding, C11000 Copper Foil, We will supply best quality, the most market competitive price, for every new and old customers with the most perfect green services.
Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

Related Product Guide:
Our well-equipped facilities and great excellent command throughout all stages of generation enables us to guarantee total customer fulfillment for Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Puerto Rico, Norwegian, Lisbon, Ensuring high product quality by choosing the best suppliers, we have also implemented comprehensive quality control processes throughout our sourcing procedures. Meanwhile, our access to a large range of factories, coupled with our excellent management, also ensures that we can quickly fill your requirements at the best prices, regardless the order size.
    • We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.
    5 Stars By Delia Pesina from Iraq - 2018.12.22 12:52
    In our cooperated wholesalers, this company has the best quality and reasonable price, they are our first choice.
    5 Stars By Debby from Argentina - 2017.08.21 14:13
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