Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM
Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
|
Classification |
Unit |
Requirement |
Test Method |
||||||||
|
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
||
|
Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
|
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
|||||||
|
Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
||||||
|
H.T.(180°C) |
≥138 |
||||||||||
|
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
|
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
|
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
| Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
||||||||
| Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
| H.T.(200°C) | Minutes |
30 |
|||||||||
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:
Related Product Guide:
We keep improving and perfecting our products and service. At the same time, we work actively to do research and development for Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Brisbane, Ghana, Honduras, Our company covers an area of 20, 000 square meters. We have more than 200 workers, professional technical team, 15 years' experience, exquisite workmanship, stable and reliable quality, competitive price and sufficient production capacity, this is how we make our customers stronger. If you have any inquiry, please do not hesitate to contact us.
By Sahid Ruvalcaba from Denmark - 2018.09.23 18:44
The factory has advanced equipment, experienced staffs and good management level, so product quality had assurance, this cooperation is very relaxed and happy!
By Carol from Nepal - 2018.09.23 17:37
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