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Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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  • Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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From the past few years, our firm absorbed and digested sophisticated technologies equally at home and abroad. Meanwhile, our organization staffs a group of experts devoted into the growth of 3/8 Oz Copper Foil, Copper Foil Insulation, Battery Foil, Teamwork is encouraged at all levels with regular campaigns. Our research team experiments on various developments in the industry for improvement in the products.
Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

Related Product Guide:
We have probably the most state-of-the-art output equipment, experienced and qualified engineers and workers, recognized good quality manage systems plus a friendly skilled income workforce pre/after-sales support for Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Turkey, Pakistan, Chicago, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our merchandise are favored by domestic and foreign customers. With your support, we'll build a better tomorrow!
    • This manufacturer can keep improving and perfecting products and service, it is in line with the rules of market competition, a competitive company.
    5 Stars By Renata from Sao Paulo - 2017.09.28 18:29
    The company's products very well, we have purchased and cooperated many times, fair price and assured quality, in short, this is a trustworthy company!
    5 Stars By Nana from Germany - 2018.08.12 12:27
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