Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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Our pursuit and firm aim should be to "Always fulfill our buyer requirements". We carry on to produce and structure top-quality excellent solutions for equally our aged and new consumers and accomplish a win-win prospect for our consumers as well as us for Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Malaysia, Iceland, Ghana, It using the world's leading system for reliable operation, a low failure rate, it suitable for Argentina customers choice. Our company is situated within the national civilized cities, the traffic is very convenient, unique geographical and economic conditions. We pursue a people-oriented, meticulous manufacturing, brainstorm, build brilliant" business philosophy. Strict quality management, perfect service, reasonable price in Argentina is our stand on the premise of competition. If necessary, welcome to contact us by our website or phone consultation, we'll be happy to serve you.
  • The company can think what our think, the urgency of urgency to act in the interests of our position, can be said this is a responsible company, we had a happy cooperation!
    5 Stars By Christopher Mabey from Vietnam - 2017.12.31 14:53
    This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
    5 Stars By Gladys from Liberia - 2018.09.21 11:01
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