Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Our firm aims to operating faithfully, serving to all of our consumers , and working in new technology and new machine continually for 6n Copper Foil, Copper Cu, Hte Copper Foil, "Making the Products of High Quality" is the eternal goal of our company. We make unremitting efforts to realize the goal of "We Will Always Keep in Pace with the Time".
Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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Our firm sticks to the basic principle of "Quality is the life of your company, and status will be the soul of it" for Low MOQ for Pure Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Liberia, Las Vegas, Cancun, Our faith is to be honest first, so we just supply high quality products to our customers. Really hope that we can be business partners. We believe that we can establish long time business relationship with each other. You can contact us freely for more information and pricelist of our products ! You will be Unique with our hair products !!
  • This is a very professional and honest Chinese supplier, from now on we fell in love with the Chinese manufacturing.
    5 Stars By Gwendolyn from Salt Lake City - 2018.06.12 16:22
    We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
    5 Stars By Carey from Greece - 2018.06.18 17:25
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