Low price for Copper Foil Shielding – Ultra Low Profile Copper Foil For 5G High frequency Board – JM

Product Detail

Product Tags

Feedback (2)

abide by the contract", conforms on the market requirement, joins from the market competition by its good quality likewise as provides more comprehensive and superb support for customers to let them become large winner. The pursue of the company, is definitely the clients' pleasure for Mri Copper Coil, Copper Foil 5 Micron, Copper Foil 8 Mil, The concept of our corporation is "Sincerity, Speed, Services, and Satisfaction". We're going to follow this concept and gain more and far more customers' pleasure.

Low price for Copper Foil Shielding – Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

Product detail pictures:

Related Product Guide:

We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of Low price for Copper Foil Shielding – Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Adelaide, Norwegian, Slovakia, Our products are widely recognized and trusted by users and can meet continuously changing economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!

Copper Foil 0.05mm