Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Coarsening Reverse Treated Copper Foil – JM

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Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Coarsening Reverse Treated Copper Foil – JM Detail:

Detail

● Thickness: 12um 18um 35um 70um
● Standard Width: 1290mm, we can do cutting as size requirement
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-30days
● Term: FOB, CIF…
● Payment item: 50%T/T deposit, balance pay before shipping.

Features

● Reverse treated copper foil
● Low profile, with high peel strength
● The treated foil is pink
● As reverse-treated copper foil, this product has better etchability performance. It can effectively shorten the production process, achieve higher speed and fast micro-etching, and improve the conformance rate of PCBs.

Application

● High frequency, Ultra -high frequency, applying to PPE board
● Fine circuit pattern
● It is mainly applied in multilayered boards and high-frequency boards.

Typical Properties of Low Coarsening Reverse Treated Copper Foil

Classification			Unit	Requirement				Test Method
Nominal thickness			um	12	18	35	70	IPC-4562A
Area Weight			g/m²	107±5	153±7	285± 10	585± 20	IPC-TM-650 2.2.12
Purity			%	≥99.8				IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)		um	3.0				IPC-TM-650 2.2.17
	Matte side(Rz)		um	≤5.0	≤6.0	≤8.0	≤10
Tensile Strength	R.T.(23°C)		Mpa	≥276				IPC-TM-650 2.4.18
	H.T.(180°C)			≥138
Elongation	R.T.(23°C)		%	≥4	≥4	≥8	≥12	IPC-TM-650 2.4.18
	H.T.(180°C)			≥3	≥4	≥4	≥4
Peel Strength(FR-4)			N/mm	≥1.0	≥1.2	≥1.4	≥1.8	IPC-TM-650 2.4.8
			Lbs/in	≥5.7	≥7.4	≥8.0	≥10.2
Pinholes & porosity			Numbers	No				IPC-TM-650 2.1.2
Anti-oxidization		R.T.(23°C)	Days	90
		H.T.(200°C)	Minutes	30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Electrolytic copper foil Image

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1290mm Wide 105um / 3oz Thickness