Manufacturer for Reverse Treated Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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Manufacturer for Reverse Treated Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification		Unit	Requirement								Test Method
Nominal thickness		Um	12	18		25	35	50	70	105	IPC-4562A
Area Weight		g/m²	107±5	153±7		225±8	285± 10	435±15	585± 20	870±30	IPC-TM-650 2.2.12.2
Purity		%	≥99.8								IPC-TM-650 2.3.15
roughness	Shiny side (Ra)	սm	≤0.43								IPC-TM-650 2.3.17
roughness	Matte side(Rz)	um	≤4.5	≤5.0		≤6.0	≤7.0	≤8.0	≤12	≤14	IPC-TM-650 2.3.17
Tensile Strength	R.T.(23°C)	Mpa	≥207				≥276				IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥138								IPC-TM-650 2.4.18
Elongation	R.T.(23°C)	%	≥4	≥4		≥5	≥8	≥10	≥12	≥12	IPC-TM-650 2.4.18
Elongation	H.T.(180°C	%	≥4	≥4		≥5	≥6	≥8	≥8	≥8	IPC-TM-650 2.4.18
Resistivity		Ω.g/m²	≤0.17 0	≤0.1 66			≤0.16 2		≤0.16 2	≤0.16 2	IPC-TM-650 2.5.14
Peel Strength(FR-4)		N/mm	≥1.0	≥1.3			≥1.6		≥1.6	≥2.1	IPC-TM-650 2.4.8
Pinholes & Porosity		Number			No						IPC-TM-650 2.1.2
Anti-oxidization	R.T.(23°C)	Days			180
Anti-oxidization	H.T.(200°C)	Minutes			30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

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We have now numerous great personnel members good at advertising, QC, and working with kinds of troublesome dilemma from the creation course of action for Manufacturer for Reverse Treated Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Holland, Ethiopia, Guyana, Corporate goal: Customers' satisfaction is our goal, and sincerely hope to establish long-terms stable cooperative relations with customers to jointly develop the market. Building brilliant tomorrow together!Our company regards "reasonable prices, efficient production time and good after-sales service" as our tenet. We hope to cooperate with more customers for mutual development and benefits. We welcome potential buyers to contact us.

1 Oz Copper Foil