Manufacturer of Copper Foil 0.05 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" and the theory of "quality the basic, belief the very first and management the advanced" for Nickel Foil Roll, Copper Foil Insulation, 6micron Copper Foil, Our company is dedicated to providing customers with high and stable quality products at competitive price, making every customer satisfied with our products and services.
Manufacturer of Copper Foil 0.05 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Manufacturer of Copper Foil 0.05 - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Manufacturer of Copper Foil 0.05 - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We pursue the management tenet of "Quality is superior, Service is supreme, Reputation is first", and will sincerely create and share success with all clients for Manufacturer of Copper Foil 0.05 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Belarus, Argentina, Florida, Now we are sincerely consider to grant brand agent in different areas and our agents' maximum margin of profit is the most important thing we care about. Welcome all of the friends and customers to join us. We are ready to share win-win corporation.
  • In China, we have many partners, this company is the most satisfying to us, reliable quality and good credit, it is worth appreciation.
    5 Stars By Sarah from Bahrain - 2018.06.05 13:10
    This company has the idea of "better quality, lower processing costs, prices are more reasonable", so they have competitive product quality and price, that's the main reason we chose to cooperate.
    5 Stars By Ophelia from Argentina - 2018.04.25 16:46
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