Massive Selection for Copper Foil On Pcb - Low Coarsening Reverse Treated Copper Foil – JM
Massive Selection for Copper Foil On Pcb - Low Coarsening Reverse Treated Copper Foil – JM Detail:
Detail
● Thickness: 12um 18um 35um 70um
● Standard Width: 1290mm, we can do cutting as size requirement
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-30days
● Term: FOB, CIF…
● Payment item: 50%T/T deposit, balance pay before shipping.
Features
● Reverse treated copper foil
● Low profile, with high peel strength
● The treated foil is pink
● As reverse-treated copper foil, this product has better etchability performance. It can effectively shorten the production process, achieve higher speed and fast micro-etching, and improve the conformance rate of PCBs.
Application
● High frequency, Ultra -high frequency, applying to PPE board
● Fine circuit pattern
● It is mainly applied in multilayered boards and high-frequency boards.
Typical Properties of Low Coarsening Reverse Treated Copper Foil
Classification |
Unit |
Requirement |
Test Method |
|||||
Nominal thickness |
um |
12 |
18 |
35 |
70 |
IPC-4562A |
||
Area Weight |
g/m² |
107±5 |
153±7 |
285± 10 |
585± 20 |
IPC-TM-650 2.2.12 |
||
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
|||||
Roughness |
Shiny side (Ra) |
um |
3.0 |
IPC-TM-650 2.2.17 |
||||
Matte side(Rz) |
um |
≤5.0 |
≤6.0 |
≤8.0 |
≤10 |
|||
Tensile Strength |
R.T.(23°C) |
Mpa |
≥276 |
IPC-TM-650 2.4.18 |
||||
H.T.(180°C) |
≥138 |
|||||||
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥8 |
≥12 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C) |
≥3 |
≥4 |
≥4 |
≥4 |
||||
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.2 |
≥1.4 |
≥1.8 |
IPC-TM-650 2.4.8 |
||
Lbs/in |
≥5.7 |
≥7.4 |
≥8.0 |
≥10.2 |
||||
Pinholes & porosity |
Numbers |
No |
IPC-TM-650 2.1.2 |
|||||
Anti-oxidization |
R.T.(23°C) |
Days |
90 |
|
||||
H.T.(200°C) |
Minutes |
30 |
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Electrolytic copper foil Image
Product detail pictures:

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