Matte Side Treatment Low Profile Copper in Black/red (LP-S-B/R)

Thickness: 10um 12um 18um 25um 35um

Standard Width: 520mm1040mm 1100mm,Max.1300mm; can be cutting as per size request

Wooden box package


Product Detail

Product Tags

Detail

Thickness: 10um 12um 18um 25um 35um
Standard Width: 520mm1040mm 1100mm, Max.1300mm; can be cutting as per size request.
Wooden box package
ID:76 mm, 152 mm
Length: Customized
Sample can be supply

Features

By increasing the density of the roughening treatment particles compared to previous products, this ultra low roughness copper foil boasts stronger adhesion to various substrates without increasing roughness. In addition to adhesion strength, it also offers various other features that enhance functionality and directly improve board reliability, such as long-term heat resistance and chemical resistance.

Low profile for FCCL
Grain structure of copper foil leads to high flexibility
Excellent etching performance
The treated foil is red or black
Low profile enables to make fine circuit pattern

Typical application

Casting and lamination type FCCL
Fine pattern FPC&PWB
Chip on flex for LED
For FPC or Inner layer
Despite the low roughness, this foil offers high adhesion strength, heat resistance, and high chemical resistance for use in a wide variety of application

Typical properties of Matte Side Treatment Low Profile Copper Foil
Classification

Unit

Requirement

Test Method

Nominal thickness

Um

10

12

16

25

35

IPC-4562A

Area Weight

g/m²

98±4

107±4

153± 5

228± 8

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤2.5

≤2.5

≤2.5

≤2.5

≤2.5

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.0

≤4.5

≤5.5

≤6.0

≤8.0

Tensile Strength

R.T.(23°C)

Mpa

≥260

≥260

≥280

≥280

≥280

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

≥10

≥12

IPC-TM-650 2.4.18

 

H.T.(180°C)

≥5

≥6

≥7

≥8

≥8

Peel Strength(FR-4)

N/mm

≥0.7

0.8

1.0

1.1

1.2

IPC-TM-650 2.4.8

 

lbs/in

≥4

≥4.6

≥5.7

≥6.3

≥6.9

Pinholes & porosity

Number

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

 

180

 

R.T.(200°C)

 

60

 

Standard Width: 520mm1040mm 1100mm, Max.1300mm May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

  • Previous:
  • Next:

  • Write your message here and send it to us