New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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We believe in: Innovation is our soul and spirit. Top quality is our life. Purchaser need is our God for Copper Foil Etching, Copper Cu, Rolled Annealed Copper Foil, We believe that a passionate, innovative and well-trained team will be able to establish good and mutually beneficial business relationships with you soon. Please feel free to contact us for more details.
New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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High quality Very first,and Shopper Supreme is our guideline to offer the most beneficial company to our clients.Nowadays, we're hoping our best to be certainly one of the top exporters in our area to satisfy consumers additional will need for New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: UK, Melbourne, Lithuania, We integrate all our advantages to continuously innovate, improve and optimize our industrial structure and product performance. We will always believe in and work on it. Welcome to join us to promote green light, together we will make a better Future!
  • Customer service staff and sales man are very patience and they all good at English, product's arrival is also very timely, a good supplier.
    5 Stars By Lydia from Poland - 2018.12.22 12:52
    Hope that the company could stick to the enterprise spirit of "Quality, Efficiency, Innovation and Integrity", it will be better and better in the future.
    5 Stars By Pandora from Oslo - 2017.03.07 13:42
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