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New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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  • New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

Related Product Guide:
The customer satisfaction is our primary goal. We uphold a consistent level of professionalism, quality, credibility and service for New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Mexico, Lyon, Plymouth, Item have passed by means of the national qualified certification and been well received in our main industry. Our expert engineering team will often be ready to serve you for consultation and feedback. We have been able to also deliver you with cost-free samples to meet your specs. Ideal efforts will probably be produced to deliver you the most beneficial service and solutions. Should really you be interested in our company and solutions, please make contact with us by sending us emails or call us straight away. To be able to know our solutions and enterprise. ar more, you'll be able to come to our factory to see it. We will constantly welcome guests from all over the world to our firm. o build business enterprise. elations with us. You should feel absolutely free to speak to us for organization. nd we believe we are going to share the best trading practical experience with all our merchants.
    • The company leader recept us warmly, through a meticulous and thorough discussion, we signed a purchase order. Hope to cooperate smoothly
    5 Stars By Sabrina from Morocco - 2018.06.28 19:27
    The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Carol from Japan - 2018.06.26 19:27
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