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Newly Arrival Copper Foil For Pcb Manufacturers - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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  • Newly Arrival Copper Foil For Pcb Manufacturers - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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Newly Arrival Copper Foil For Pcb Manufacturers - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Newly Arrival Copper Foil For Pcb Manufacturers - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

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We will devote ourselves to giving our esteemed buyers using the most enthusiastically thoughtful services for Newly Arrival Copper Foil For Pcb Manufacturers - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: United Arab Emirates, Serbia, Ottawa, Providing Quality Products, Excellent Service, Competitive Prices and Prompt Delivery. Our products are selling well both in domestic and foreign markets. Our company is trying to be one important suppliers in China.
    • Perfect services, quality products and competitive prices, we have work many times, every time is delighted, wish continue to maintain!
    5 Stars By Dorothy from Norwegian - 2017.01.28 19:59
    Timely delivery, strict implementation of the contract provisions of the goods, encountered special circumstances, but also actively cooperate, a trustworthy company!
    5 Stars By Fanny from Hungary - 2018.09.29 13:24
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