OEM Factory for Copper Foil 1 Mm - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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owing to very good support, a variety of high quality merchandise, aggressive costs and efficient delivery, we love an excellent name among the our clients. We are an energetic company with wide market for Copper Foil 8 Mil, Battery Copper Foil, Reverse Treated Copper Foil, At our firm with good quality initially as our motto, we manufacture merchandise that are entirely made in Japan, from materials procurement to processing. This enables them for being used with confident peace of mind.
OEM Factory for Copper Foil 1 Mm - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM Factory for Copper Foil 1 Mm - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

OEM Factory for Copper Foil 1 Mm - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our rewards are lower costs,dynamic profits team,specialised QC,potent factories,high-quality services for OEM Factory for Copper Foil 1 Mm - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Ghana, Toronto, Mexico, Welcome any of your inquiries and concerns for our products. We look forward to establishing a long-term business relationship with you in the near future. Contact us today. We are the first business partner for you!
  • We are old friends, the company's product quality has been always very good and this time the price is also very cheap.
    5 Stars By Alice from Latvia - 2018.12.11 11:26
    The company's products very well, we have purchased and cooperated many times, fair price and assured quality, in short, this is a trustworthy company!
    5 Stars By Kevin Ellyson from Saudi Arabia - 2018.06.19 10:42
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