OEM Manufacturer Copper Foil 1 Mil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Every single member from our higher effectiveness product sales staff values customers' requires and organization communication for Copper Nickel Foil, 3 Oz Copper Foil-, Rf Shielding Foil, As an experienced group we also accept custom-made orders. The main intention of our firm is to build up a satisfying memory for all consumers, and set up a long-term win-win small business connection.
OEM Manufacturer Copper Foil 1 Mil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM Manufacturer Copper Foil 1 Mil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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With responsible good quality method, good status and excellent client services, the series of solutions produced by our company are exported to lots of countries and regions for OEM Manufacturer Copper Foil 1 Mil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Doha, Spain, Sydney, Business philosophy: Take the customer as the Center, take the quality as the life, integrity, responsibility, focus, innovation.We will provide professional, quality in return for the trust of customers, with most major global suppliers,all of our employees will work together and move forward together.
  • This supplier offers high quality but low price products, it is really a nice manufacturer and business partner.
    5 Stars By Judy from Indonesia - 2017.09.29 11:19
    The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
    5 Stars By Cindy from Yemen - 2017.11.29 11:09
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