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OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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  • OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

Related Product Guide:
Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" as well as theory of "quality the basic, have faith in the initial and administration the advanced" for OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Kuwait, United States, Milan, Our staffs are adhering to the "Integrity-based and Interactive Development" spirit, and the tenet of "First-class Quality with Excellent Service". According to the needs of every customer, we provide customized & personalized services to help customers achieve their goals successfully. Welcome clients from home and abroad to call and inquire!
    • The goods we received and the sample sales staff display to us have the same quality, it is really a creditable manufacturer.
    5 Stars By Althea from Greece - 2017.09.29 11:19
    Although we are a small company, we are also respected. Reliable quality, sincere service and good credit, we are honored to be able to work with you!
    5 Stars By Cornelia from Luxembourg - 2017.06.16 18:23
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