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OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM

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  • OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM

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OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM detail pictures

Related Product Guide:
All we do is usually connected with our tenet " Customer to start with, Rely on initial, devoting on the food packaging and environmental protection for OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Slovenia, Ecuador, Pakistan, We will not only continuously introduce technical guidance of experts from both home and abroad, but also develop the new and advanced products constantly to satisfactorily meet the needs of our clients all over the world.
    • The factory workers have a good team spirit, so we received high quality products fast, in addition, the price is also appropriate, this is a very good and reliable Chinese manufacturers.
    5 Stars By EliecerJimenez from British - 2017.06.19 13:51
    In China, we have purchased many times, this time is the most successful and most satisfactory, a sincere and realiable Chinese manufacturer!
    5 Stars By Fiona from Buenos Aires - 2017.08.18 18:38
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