One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We strive for excellence, service the customers", hopes to become the best cooperation team and dominator enterprise for personnel, suppliers and customers, realizes value share and continuous promotion for Very Low Profile Copper Foil, Thin Copper Foil, Copper Foil For Graphene Growth, We welcome new and outdated clients from all walks of daily life to get hold of us for long term organization associations and achieving mutual results!
One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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With the "Client-Oriented" business philosophy, a rigorous quality control system, advanced manufacturing equipment and a strong R&D team, we always provide high quality products, excellent services and competitive prices for One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Philadelphia, Hamburg, Monaco, Qualified R&D engineer might be there for your consultation service and we will try our best to meet your requirements. So you should feel free to contact us for inquiries. You'll be able to send us emails or call us for small business. Also you are able to come to our business by yourself to get further knowing of us. And we are going to surely present you with the best quotation and after-sale service. We're ready to build stable and friendly relations with our merchants. To achieve mutual success, we'll make our best efforts to build a solid co-operation and transparent communication work with our companions. Above all, we're here to welcome your inquiries for any of our merchandise and service.
  • This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
    5 Stars By Bruno Cabrera from Paris - 2017.02.18 15:54
    The factory has advanced equipment, experienced staffs and good management level, so product quality had assurance, this cooperation is very relaxed and happy!
    5 Stars By Lilith from Netherlands - 2018.05.13 17:00
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