One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Often customer-oriented, and it's our ultimate target to become not only probably the most reputable, trustable and honest provider, but also the partner for our customers for Copper Foil Hte, Vlp Copper Foil, Copper Foil For Lithium Battery, our merchandise have superior popularity from the whole world as its most competive cost and our most advantage of after-sale assistance for the clients。
One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

All we do is usually connected with our tenet " Consumer initial, Rely on 1st, devoting around the food stuff packaging and environmental safety for One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Hamburg, Libya, Guinea, With the effort to keep pace with world's trend, we'll always endeavor to meet customers' demands. If you want develop any other new items, we can customize them to suit your needs. If you feel interest in any of our products and solutions or want develop new merchandise, you should feel free to contact us. We are looking forward to forming successful business relationship with customers all over the world.
  • The company can keep up with the changes in this industry market, product updates fast and the price is cheap, this is our second cooperation, it's good.
    5 Stars By Mary from Romania - 2017.06.22 12:49
    With a positive attitude of "regard the market, regard the custom, regard the science", the company works actively to do research and development. Hope we have a future business relationships and achieving mutual success.
    5 Stars By Linda from Salt Lake City - 2018.09.16 11:31
    Write your message here and send it to us