One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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With our leading technology at the same time as our spirit of innovation,mutual cooperation, benefits and development, we are going to build a prosperous future alongside one another with your esteemed enterprise for Copper Strip Coil, Copper Foil 99.9999, Electrodeposited Copper Foil, We will wholeheartedly welcome all clients in the industry both at home and abroad to cooperate hand in hand, and create a bright future together.
One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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We pursue the administration tenet of "Quality is superior, Services is supreme, Standing is first", and will sincerely create and share success with all customers for One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Buenos Aires, Ukraine, Turkey, We have a strict and complete quality control system, which ensures that each product can meet quality requirements of customers. Besides, all of our products have been strictly inspected before shipment.
  • The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Natalie from Pakistan - 2018.05.15 10:52
    The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
    5 Stars By Odelette from Japan - 2017.11.12 12:31
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