professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Our enhancement depends around the sophisticated devices ,exceptional talents and repeatedly strengthened technology forces for Copper Foil 5 Micron, Copper Foil Korea, 5 Mil Copper Foil, We take quality as the foundation of our success. Thus, we focus on the manufacture of the best quality products. A strict quality management system has been created to ensure the quality of the products.
professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Every single member from our large efficiency revenue team values customers' wants and company communication for professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Nigeria, Palestine, Bangkok, We strongly believe that technology and service is our base today and quality will create our reliable walls of future. Only we've got better and better quality , could we achieve our customers and ourselves, too. Welcome customers all over the word to contact us for getting further business and reliable relationships. We have been always here working for your demands whenever you require.
  • Reasonable price, good attitude of consultation, finally we achieve a win-win situation,a happy cooperation!
    5 Stars By Florence from Argentina - 2018.05.22 12:13
    This manufacturer can keep improving and perfecting products and service, it is in line with the rules of market competition, a competitive company.
    5 Stars By Janet from Lesotho - 2017.11.12 12:31
    Write your message here and send it to us