professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We thinks what customers think, the urgency of urgency to act in the interests of a customer position of principle, allowing for better quality, lower processing costs, prices are more reasonable, won the new and old customers the support and affirmation for 5 Micron Copper Foil, Graphite Coated Copper Foil, Rolled Annealed Copper Foil, We are highly aware of quality, and have the certification ISO/TS16949:2009. We are dedicated to supply you high quality products with reasonable price.
professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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With our rich experience and considerate services, we have been recognized as a reliable supplier for many international buyers for professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: America, Portugal, Senegal, The president and all the company members would like to provide qualified goods and services for customers and sincerely welcome and cooperate with all native and foreign customers for a bright future.
  • The factory has advanced equipment, experienced staffs and good management level, so product quality had assurance, this cooperation is very relaxed and happy!
    5 Stars By Andrew Forrest from Manila - 2017.12.19 11:10
    Adhering to the business principle of mutual benefits, we have a happy and successful transaction, we think we will be the best business partner.
    5 Stars By Dorothy from Niger - 2017.06.16 18:23
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