professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Innovation, excellent and reliability are the core values of our firm. These principles today more than ever form the basis of our success as an internationally active mid-size corporation for Electrolytic Copper Foil Manufacturers, Copper Foil Insulation, Copper Foil Rf Shielding, We have a professional team for international trade. We can solve the problem you meet. We can provide the products you want. Please feel free to contact us.
professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Being supported by an advanced and specialist IT team, we could give technical support on pre-sales & after-sales services for professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Guyana, Latvia, Cancun, Our market share of our products and solutions has greatly increased yearly. If you are interested in any of our products or would like to discuss a custom order, make sure you feel free to contact us. We've been looking forward to forming successful business relationships with new clients around the world in the near future. We've been looking forward to your inquiry and order.
  • We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.
    5 Stars By Julie from Australia - 2017.08.16 13:39
    Products and services are very good, our leader is very satisfied with this procurement, it is better than we expected,
    5 Stars By Genevieve from Salt Lake City - 2017.09.09 10:18
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