Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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As for competitive selling prices, we believe that you will be searching far and wide for anything that can beat us. We will state with absolute certainty that for such excellent at such charges we are the lowest around for Electrodeposited Copper Foils, Ra Copper Foil With Nickel Plating, Buy Copper Foil, We warmly welcome customers from all over the world for any kind of cooperation with us to build a mutual benefit future. We are devoting ourselves wholeheartedly to offer customers the best service.
Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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The purchaser fulfillment is our primary focus on. We uphold a consistent level of professionalism, high quality, credibility and service for Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Netherlands, Cambodia, Botswana, To let customers be more confident in us and get the most comfortable service, we run our company with honesty, sincerity and best quality . We firmly believe that it is our pleasure to help customers to run their business more successfully, and that our professional advice and service can lead to more suitable choice for the customers.
  • After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
    5 Stars By Nina from Greece - 2018.06.28 19:27
    The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Christian from United Arab emirates - 2017.12.02 14:11
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