Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

The company upholds the philosophy of "Be No.1 in quality, be rooted on credit and trustworthiness for growth", will continue to serve old and new customers from home and overseas whole-heatedly for Phone Copper Foil, 2 Mil Copper Foil, Ed Copper, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

In an effort to finest meet up with client's requirements, all of our operations are strictly performed in line with our motto "High High quality, Competitive Rate, Fast Service" for Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Qatar, Dominica, Victoria, We offer OEM services and replacement parts to meet the varying needs of our customers. We offer competitive price for quality products and we will make certain your shipment is handled quickly by our logistics department. We sincerely hope to have the opportunity to meet with you and see how we can help you further your own business.
  • This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
    5 Stars By Joanne from Portland - 2017.02.18 15:54
    Staff is skilled, well-equipped, process is specification, products meet the requirements and delivery is guaranteed, a best partner!
    5 Stars By Marcy Real from Mombasa - 2017.06.25 12:48
    Write your message here and send it to us