Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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Our enterprise since its inception, often regards solution excellent as enterprise life, continually strengthen output technology, enhance product high quality and continually strengthen organization total high-quality administration, in strict accordance using the national standard ISO 9001:2000 for 1 Ounce Copper Foil, Foil Shield, Copper Foil Thickness, If possible, be sure to send your needs with a detailed list including the style/item and quantity you require. We will then deliver our greatest price ranges to you.

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

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We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Jakarta, Albania, Iraq, Our staffs are adhering to the "Integrity-based and Interactive Development" spirit, and the tenet of "First-class Quality with Excellent Service". According to the needs of every customer, we give customized & personalised services to help customers achieve their goals successfully. Welcome clients from home and abroad to call and inquire!

99.99% Copper Foil