Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Our products are broadly regarded and reliable by end users and can meet up with constantly transforming financial and social requires of Rolled Annealed Copper, Copper Foil Insulation, Copper Foil 0.0005, To significantly improve our service quality, our company imports a large number of foreign advanced devices. Welcome clients from home and abroad to call and inquire!
Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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That has a sound business enterprise credit rating, exceptional after-sales provider and modern producing facilities, we now have earned an superb standing amongst our buyers across the world for Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Yemen, Argentina, Sri Lanka, Our solutions are widely recognized and trusted by users and can meet continuously changing of economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
  • This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
    5 Stars By Naomi from Lesotho - 2018.11.04 10:32
    In China, we have purchased many times, this time is the most successful and most satisfactory, a sincere and realiable Chinese manufacturer!
    5 Stars By Gustave from Morocco - 2018.12.14 15:26
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