Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Our rewards are lower costs,dynamic profits team,specialised QC,potent factories,high-quality services for Copper Foil For Shielding, Copper Cu, 1290mm Wide 105um / 3oz Thickness, We take quality as the foundation of our success. Thus, we focus on the manufacture of the best quality products. A strict quality management system has been created to ensure the quality of the products.
Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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We thinks what prospects think, the urgency of urgency to act from the interests of a client position of theory, allowing for greater high-quality, reduced processing costs, rates are much more reasonable, won the new and previous consumers the support and affirmation for Renewable Design for 5 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Russia, Salt Lake City, Italy, With nearly 30 years' experience in business, we are confident in superior service, quality and delivery. We warmly welcome customers from all over the world to cooperate with our company for common development.
  • We have been looking for a professional and responsible supplier, and now we find it.
    5 Stars By ROGER Rivkin from Iran - 2018.11.28 16:25
    This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
    5 Stars By Mary from Malta - 2018.02.08 16:45
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