Short Lead Time for 6micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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Short Lead Time for 6micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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Short Lead Time for 6micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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Our organization insists all along the quality policy of "product quality is base of business survival; purchaser gratification is the staring point and ending of an business; persistent improvement is eternal pursuit of staff" as well as the consistent purpose of "reputation 1st, purchaser first" for Short Lead Time for 6micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Croatia, Indonesia, Yemen, Welcome any of your inquiries and concerns for our products. We look forward to establishing a long-term business relationship with you in the near future. Contact us today. We are the first business partner for you!
  • The supplier abide the theory of "quality the basic, trust the first and management the advanced" so that they can ensure a reliable product quality and stable customers.
    5 Stars By Marjorie from Morocco - 2017.05.02 18:28
    The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Eve from Estonia - 2017.12.09 14:01
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