Top Suppliers 1 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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To be a result of ours specialty and service consciousness, our enterprise has won an excellent status between buyers all around the globe for Reverse Treated Electrodeposited Copper Foil, Copper Coil Mri, Copper Foil 99.9999, President of our company, with whole staff, welcomes all buyers to visit our company and inspect. Let us cooperate hand in hand to make a good future.
Top Suppliers 1 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Top Suppliers 1 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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We have now numerous great personnel members good at advertising, QC, and working with kinds of troublesome dilemma from the creation course of action for Top Suppliers 1 Mil Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Dubai, Uzbekistan, Ghana, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.
  • The enterprise has a strong capital and competitive power, product is sufficient, reliable, so we have no worries on cooperating with them.
    5 Stars By Alexander from Israel - 2017.01.11 17:15
    Adhering to the business principle of mutual benefits, we have a happy and successful transaction, we think we will be the best business partner.
    5 Stars By Mary from Malawi - 2018.06.21 17:11
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