Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High speed digital – JM

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Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High speed digital – JM Detail:

Features

● Ultra low profile with high peel strength and good etch ability
● Use Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit
● The treated foil is pink

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Hyper Very Low profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

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Our primary target will be to provide our clients a serious and responsible small business relationship, supplying personalized attention to all of them for Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High speed digital – JM , The product will supply to all over the world, such as: Mombasa, Bangladesh, Rwanda, Since always, we adhering to the "open and fair, share to get, the pursuit of excellence, and creation of value"values, adhere to the"integrity and efficient, trade-oriented, best way , best valve" business philosophy. Together with our all over the world have branches and partners to develop new business areas, maximum common values. We sincerely welcome and together we share in global resources, opening up new career together with the chapter.

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