Well-designed Vlp-2 Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM


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"Control the standard by the details, show the toughness by quality". Our firm has strived to establish a highly efficient and stable workers workforce and explored an effective high-quality management system for Copper Foil 10 Micron, Pcb Copper Foil Thickness Tolerance, 9 Micron Copper Foil, We promise to try our greatest to deliver you with high quality and economical products and services.
Well-designed Vlp-2 Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Well-designed Vlp-2 Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM detail pictures


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"Based on domestic market and expand overseas business" is our improvement strategy for Well-designed Vlp-2 Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Tajikistan, Tunisia, Mongolia, We are very responsible for all details on our customers order no matter on warranty quality, satisfied prices, quick delivery, on time communication, satisfied packing, easy payment terms, best shipment terms, after sales service etc. We provide one-stop service and best reliability to our every customers. We work hard with our customers, colleagues, workers to make a better future.
  • The factory technical staff gave us a lot of good advice in the cooperation process, this is very good, we are very grateful.
    5 Stars By Belle from Guyana - 2017.06.16 18:23
    The factory technical staff gave us a lot of good advice in the cooperation process, this is very good, we are very grateful.
    5 Stars By Melissa from Casablanca - 2017.08.15 12:36
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