Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We stick to our enterprise spirit of "Quality, Performance, Innovation and Integrity". We purpose to create a lot more price for our prospects with our rich resources, innovative machinery, experienced workers and great products and services for Hot Sale Lithium Ion Battery Grade Copper Foil, Copper Strip Coil, Thin Copper Foil, We welcome new and previous buyers from all walks of life to make contact with us for upcoming organization associations and mutual good results!
Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We insist over the principle of enhancement of 'High high quality, Efficiency, Sincerity and Down-to-earth working approach' to offer you with superb assistance of processing for Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Macedonia, Belize, Provence, We provide OEM services and replacement parts to meet the varying needs of our customers. We give competitive price for quality solutions and we are going to make certain your shipment is handled quickly by our logistics department. We sincerely hope to have the opportunity to meet with you and see how we can help you further your own business.
  • This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
    5 Stars By Penny from French - 2018.05.13 17:00
    Hope that the company could stick to the enterprise spirit of "Quality, Efficiency, Innovation and Integrity", it will be better and better in the future.
    5 Stars By Isabel from Luxemburg - 2018.06.21 17:11
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