Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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"Sincerity, Innovation, Rigorousness, and Efficiency" could be the persistent conception of our enterprise to the long-term to produce together with clients for mutual reciprocity and mutual profit for Copper Foils For Pcb, Copper Foil Insulation, The Grade 3 Copper Foil, Our group members are goal to provides merchandise with significant performance cost ratio to our consumers, as well as target for all of us is usually to satisfy our consumers from all around the environment.
Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We offer fantastic energy in high quality and enhancement,merchandising,profits and promoting and procedure for Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Morocco, Bahrain, Iran, At Present, our products have been exported to more than sixty countries and different regions, such as Southeast Asia, America, Africa, Eastern Europe, Russia, Canada etc. We sincerely hope to establish wide contact with all potential customers both in China and the rest part of the world.
  • The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
    5 Stars By Helen from Canada - 2017.06.22 12:49
    This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
    5 Stars By Jocelyn from Sao Paulo - 2017.07.28 15:46
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