Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Fast and good quotations, informed advisers to help you choose the correct product that suits all your needs, a short production time, responsible quality control and different services for paying and shipping affairs for Copper Foil Thickness, 5 Micron Copper Foil, Copper Foil Graphene, Items won certifications with the regional and international primary authorities. For far more detailed information, please contact us!
Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Usually customer-oriented, and it's our ultimate focus on to be not only by far the most reliable, trustable and honest provider, but also the partner for our customers for Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Cancun, Germany, Sri Lanka, Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products are sold very well in the countries in Africa, the Mid-East and Southeast Asia.
  • The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Brook from Orlando - 2018.06.28 19:27
    The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
    5 Stars By Teresa from Brisbane - 2017.08.18 11:04
    Write your message here and send it to us